澳门·金威尼斯(中国)游戏平台-正版BEST PIATFORM

Five core technologies SOLUTION

Purity control and purification technology of high purity metals

Because the impurities in the metal material will affect the conductivity of downstream products such as semiconductor chips, the sputtering target has a high requirement on the purity of the metal material. Through independent R & D and cooperative R & D, the company has the technical ability to produce high-purity metal materials for sputtering targets (copper purity ≥ 99.9999%; aluminum and titanium purity ≥ 99.999%; tantalum purity ≥ 99.99%), greatly improving the market competitiveness of the enterprise.
Grain orientation control technology

The size and arrangement direction of the grains directly determine the uniformity and sputtering speed of the sputtering film, and affect the quality and performance of the downstream products. Therefore, the control of the grain orientation is the core technology in the production process of the sputtering target. The company has a metal material plastic deformation processing production line and internal organization structure detection equipment. Through scientific process arrangement, the grain direction can be accurately controlled.
Large area welding technology of dissimilar metals

The welding technology is the technology of firmly welding the target blank and the back plate. The company has mastered the electron beam welding, diffusion welding, brazing and other technologies between the high-purity metal target blank and the back plate, such as aluminum, titanium, tantalum, copper, etc. the average welding bonding rate of the product is more than 99%, and the corresponding high welding strength is ensured. Among them, the company has independently developed diffusion welding technology for aluminum target and titanium target.
Metal precision machining and special treatment technology

The machines used by the downstream customers for target sputtering are very precise and have high requirements for the size of the sputtering target. Small deviations will affect the sputtering reaction process and the performance of the sputtering products. The company has a batch of large-scale precision processing equipment such as machining centers and CNC lathes, which can accurately control the size and deviation of the products. The product size tolerance is less than 10 microns and the surface roughness is less than 0.4 microns.
Cleaning and packaging technology of target

The production environment of the downstream customers and the cavity of the sputtering reaction machine have high requirements on the cleanliness of the sputtering target. The company uses the self-designed full-automatic target cleaning machine to repeatedly clean the product and dry the product in the vacuum environment. The surface cleanliness of the sputtering target used to produce semiconductor chips can reach the electronic level.

About Us

ABOUT KFMI

Konfoong Materials International Co., Ltd. founded in 2005, specializes in the research and development and production of ultra-high purity metal materials and sputtering targets for the manufacture of ultra-large scale integrated circuits. The company has been successfully listed on the Shenzhen Stock Exchange in June 2017 with stock code 300666.

KFMI Spirit

KFMI Mission: Quality for the future
KFMI Goal: To achieve resource-saving and environment-friendly sustainable development
KFMI's responsibility: to add glory to "Made in China" and to give more connotation to "Made in China"
KFMI Spirit: Do our best in everything, persevere in everything, pursue perfection in everything, strive for the first in everything
KFMI's Commitment of : Pay back the society, serve the customers, and accomplish the staff
KFMI Style: Act now, be honest and tolerant
KFMI ethics: gratitude and glory of labour

News News and media

2022-08-15

The third publicity month against illegal securities and Futures

2022-08-15

The third publicity month against illegal securities and Futures

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